Provides coverage on the full range of topics associated with polyimides, including structure, polymer fundamentals, and product areas. The text addresses both basic and applied aspects of the subject. It details the synthesis of polyimides, polyamideimides, and flourinated polyimides, explains the molecular design of photosensitive polyimides, and more.

Polyimides have been available commercially for over 25 years, but are still frequently thought of as new materials, due largely to their performance and high technology end uses, which ensure that levels of research and development remain high. This detailed review describes the synthesis, properties, processing and applications of condensation, addition and hybrid polyimides. An additional indexed section containing several hundred abstracts from the Rapra Polymer Library database provides useful references for further reading.

Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared

This is the first book to provide an in-depth presentation of photosensitive polyimides for electronic and photonic applications. The authors are leading specialists in this field from Japan, Europe and the U.S. From the Preface Aromatic polyimides were developed originally as thermostable flexible polymer films for space applications. Now polyimides have found widespread use in the manufacture of electronic devices and have been employed in increasingly diverse areas of electronics and information technology. In addition to their excellent thermal stability and high processability, a wide range of chemical and physical properties provided by molecular engineering makes polyimides highly versatile in the electronics and information industries. Lithography of polyimides is an inevitable process in using polyimides for microelectronic fields, and hence increasing research has been devoted to developing photosensitive polyimides, which make it unnecessary to use photoresists for patterning polyimides and diminishing markedly the number of steps in fabrication of various electronic devices. In addition, the development of technology of photosensitive polyimides is expected to play a great role in manufacturing photonic devices in the near future, when the design and control of hyper fine structures . . . including higher thermal stability and better processability would be essential.

The topics covered in this proceedings volume include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.

Polyamic Acids and Polyimides surveys significant developments in basic research in the chemistry and physics of polyamic acids and polyimides over the last several years. Traditional and new topics are discussed, including catalytical imidization, chemical reactions at thermal treatment, quantum-chemical study of synthesis and structure, properties of isolated molecules, and supermolecular and crystalline structures. The book will be an excellent reference for researchers, practitioners, and graduate students working with polyimides and related heat-resistant polymers and materials.

This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003.This volume is divided into three parts. Part 1. a Synthesis, Properties and Bulk Characterizationa ; Part 2 a Hybrids and Compositesa