Materials for High-Density Electronic Packaging and Interconnection
Title | Materials for High-Density Electronic Packaging and Interconnection PDF eBook |
Author | National Research Council |
Publisher | National Academies Press |
Total Pages | 154 |
Release | 1990-02-01 |
Genre | Technology & Engineering |
ISBN | 030904233X |
Fertigfassaden & Fassaden-Systembau
Title | Fertigfassaden & Fassaden-Systembau PDF eBook |
Author | Wendker Fassaden-Systembau GmbH |
Publisher | |
Total Pages | 87 |
Release | 2001 |
Genre | |
ISBN |
Materials for High-Density Electronic Packaging and Interconnection
Title | Materials for High-Density Electronic Packaging and Interconnection PDF eBook |
Author | National Aeronautics and Space Administration (NASA) |
Publisher | Createspace Independent Publishing Platform |
Total Pages | 142 |
Release | 2018-07-18 |
Genre | |
ISBN | 9781723202131 |
Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production. Unspecified Center COMPATIBILITY; ELECTRONIC PACKAGING; SEMICONDUCTORS (MATERIALS); INDUSTRIES; LEADERSHIP; MARKETING...
Materials for High-Density Electronic Packaging and Interconnection
Title | Materials for High-Density Electronic Packaging and Interconnection PDF eBook |
Author | National Research Council |
Publisher | National Academies Press |
Total Pages | 0 |
Release | 1990-02-01 |
Genre | Technology & Engineering |
ISBN | 9780309042338 |
Materials for High-Density Electronic Packaging and Interconnection
Title | Materials for High-Density Electronic Packaging and Interconnection PDF eBook |
Author | NATIONAL MATERIALS ADVISORY BOARD (NAS-NAE) WASHINGTON DC. |
Publisher | |
Total Pages | 154 |
Release | 1990 |
Genre | |
ISBN |
Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production. (rh).
Electronic Packaging Materials and Their Properties
Title | Electronic Packaging Materials and Their Properties PDF eBook |
Author | Michael Pecht |
Publisher | CRC Press |
Total Pages | 120 |
Release | 2017-12-19 |
Genre | Technology & Engineering |
ISBN | 1498730868 |
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Electronic Packaging and Interconnection Handbook
Title | Electronic Packaging and Interconnection Handbook PDF eBook |
Author | Charles A. Harper |
Publisher | McGraw-Hill Professional Publishing |
Total Pages | 1112 |
Release | 2000 |
Genre | Technology & Engineering |
ISBN |
Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.