Low-expansion Materials

Low-expansion Materials
Title Low-expansion Materials PDF eBook
Author David P. Stinton
Publisher
Total Pages 272
Release 1995
Genre Technology & Engineering
ISBN

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Oven-to-freezer dinnerware, space shuttle insulation, and protection tubes in the molten aluminum industry are some of the applications feeding the hunger for materials with a high dimensional stability and/or thermal shock resistance over a wide temperature range. Recent advances in the basic resea

Low and Negative Thermal Expansion Materials

Low and Negative Thermal Expansion Materials
Title Low and Negative Thermal Expansion Materials PDF eBook
Author David A. Woodcock
Publisher
Total Pages 0
Release 2000
Genre
ISBN

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Negative Thermal Expansion Materials

Negative Thermal Expansion Materials
Title Negative Thermal Expansion Materials PDF eBook
Author D.J. Fisher
Publisher Materials Research Forum LLC
Total Pages 178
Release 2018-01-15
Genre Technology & Engineering
ISBN 1945291494

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In everyday life, minute thermally-induced elongations are essentially invisible to the naked eye; but even minute expansions can fatally degrade device processing and performance in – for example – the semiconductor industry. Materials which, astonishingly, contract upon heating offer the great advantage of being able to tune the overall thermal expansion of composite materials or to act as thermal-expansion compensators. The development of these negative thermal expansion materials has advanced rapidly during the past fifteen years, and a wide variety of materials of differing types has now been identified, as well as a number of intriguing mechanisms which help to avoid the apparent inviolable tendency of size to increase with temperature. The present work is the most up-to-date summary of the current range of negative thermal expansion materials and of the associated mechanisms. Negative Thermal Expansion Materials, Thermomiotic Behavior, Thermal Stress-Fracture, Thermal Expansion of Composites, Thin-Film Design, Metamaterials

ASM Ready Reference

ASM Ready Reference
Title ASM Ready Reference PDF eBook
Author Fran Cverna
Publisher ASM International
Total Pages 564
Release 2002-01-01
Genre Technology & Engineering
ISBN 0871707683

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A quick and easy to use source for qualified thermal properties of metals and alloys. The data tables are arranged by material hierarchy, with summary tables sorted by property value. Values are given for a range of high and low temperatures. Short technical discussions at the beginning of each chapter are designed to refresh the reader's understanding of the properties and units covered in that section

Thermal Expansion of Solids

Thermal Expansion of Solids
Title Thermal Expansion of Solids PDF eBook
Author Cho Yen Ho
Publisher ASM International
Total Pages 330
Release 1998-01-01
Genre Science
ISBN 9781615032150

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Provides a detailed examination of theory and techniques in thermal expansion of solids. Subjects include a generalized theory, estimation techniques and selected effects, temperature measurements in solids, thermal expansion by X-ray diffraction, high sensitivity expansivity measurement techniques,

Low-thermal-expansion-coefficient Heat-resistant Photosensitive Material

Low-thermal-expansion-coefficient Heat-resistant Photosensitive Material
Title Low-thermal-expansion-coefficient Heat-resistant Photosensitive Material PDF eBook
Author K. Wada
Publisher
Total Pages 18
Release 1989
Genre
ISBN

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Low Thermal Expansion Alloys and Composites

Low Thermal Expansion Alloys and Composites
Title Low Thermal Expansion Alloys and Composites PDF eBook
Author John J. Stephens
Publisher Tms
Total Pages 225
Release 1994
Genre Technology & Engineering
ISBN 9780873392068

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This collection of papers is drawn from Materials Week '92 held in Chicago, Illinois, November 2-5, 1992. It presents an overview of the fabrication and application of low-thermal expansion alloys and composites. Materials engineers involved in electronics and/or aerospace applications should find significant information regarding brazing, soldering and welding.