The Electromagnetic Compatibility has become an increasingly essential factor for placing a product on the global, world wide market. Fulfilling emission limits and immunity requirements as well as handling apparently complex cases of incompatibility demands a deeper understanding of the physical interrelations and of Maxwell's theory. Based on the authors’ experiences, the textbook provides some help in solving such interferential cases. It contains many illustrative examples and more than 80 exercises with solutions.

A comprehensive resource that explores electromagnetic compatibility (EMC) for aerospace systems Handbook of Aerospace Electromagnetic Compatibility is a groundbreaking book on EMC for aerospace systems that addresses both aircraft and space vehicles. With contributions from an international panel of aerospace EMC experts, this important text deals with the testing of spacecraft components and subsystems, analysis of crosstalk and field coupling, aircraft communication systems, and much more. The text also includes information on lightning effects and testing, as well as guidance on design principles and techniques for lightning protection. The book offers an introduction to E3 models and techniques in aerospace systems and explores EMP effects on and technology for aerospace systems. Filled with the most up-to-date information, illustrative examples, descriptive figures, and helpful scenarios, Handbook of Aerospace Electromagnetic Compatibility is designed to be a practical information source. This vital guide to electromagnetic compatibility: • Provides information on a range of topics including grounding, coupling, test procedures, standards, and requirements • Offers discussions on standards for aerospace applications • Addresses aerospace EMC through the use of testing and theoretical approaches Written for EMC engineers and practitioners, Handbook of Aerospace Electromagnetic Compatibility is a critical text for understanding EMC for aerospace systems.

This textbook covers the design of electronic systems from the ground up, from drawing and CAD essentials to recycling requirements. Chapter by chapter, it deals with the challenges any modern system designer faces: The design process and its fundamentals, such as technical drawings and CAD, electronic system levels, assembly and packaging issues and appliance protection classes, reliability analysis, thermal management and cooling, electromagnetic compatibility (EMC), all the way to recycling requirements and environmental-friendly design principles. "This unique book provides fundamental, complete, and indispensable information regarding the design of electronic systems. This topic has not been addressed as complete and thorough anywhere before. Since the authors are world-renown experts, it is a foundational reference for today’s design professionals, as well as for the next generation of engineering students." Dr. Patrick Groeneveld, Synopsys Inc.

High voltage engineering is extremely important for the reliable design, safe manufacture and operation of electric devices, equipment and electric power systems. The 21st International Symposium on High Voltage Engineering, organized by the 90 years old Budapest School of High Voltage Engineering, provides an excellent forum to present results, advances and discussions among engineers, researchers and scientists, and share ideas, knowledge and expertise on high voltage engineering. The proceedings of the conference presents the state of the art technology of the field. The content is simultaneously aiming to help practicing engineers to be able to implement based on the papers and researchers to link and further develop ideas.

Applied Electromagnetics and Electromagnetic Compatibility deals with Radio Frequency Interference (RFI), which is the reception of undesired radio signals originating from digital electronics and electronic equipment. With today's rapid development of radio communication, these undesired signals as well as signals due to natural phenomena such as lightning, sparking, and others are becoming increasingly important in the general area of Electro Magnetic Compatibility (EMC). EMC can be defined as the capability of some electronic equipment or system to be operated at desired levels of performance in a given electromagnetic environment without generating EM emissions unacceptable to other systems operating in the vicinity.

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Materials for Potential EMI Shielding Applications: Processing, Properties and Current Trends extensively and comprehensively reviews materials for EMI shielding applications, ranging from the principles to possible applications and various types of shielding materials. The book provides a thorough introduction to electromagnetic interference, its effect on both the environment and other electronic items, various materials that are used for electromagnetic interference shielding applications, and its properties. It explains the mechanism behind EMI shielding, the methods by which EMI SE of a given material is estimated, and the different fabrication methods currently employed for fabricating EMI shielding materials. Final sections focus on the theoretical background of EMI shielding and shielding mechanisms. This theoretical background is extended to the physics of EMI shielding, wherein the physics behind mechanism of shielding is explained. Focuses on the different types of available EMI shielding, their applications, processing, characterization, and the mechanism behind their shielding Discusses how to incorporate EMI shielding with low cost, low density and high strength Provides an understanding and clarifies both elementary and practical problems relating to EMI shielding materials