MOS technology has rapidly become the de facto standard for mixed-signal integrated circuit design due to the high levels of integration possible as device geometries shrink to nanometer scales. The reduction in feature size means that the number of transistor and clock speeds have increased significantly. In fact, current day microprocessors contain hundreds of millions of transistors operating at multiple gigahertz. Furthermore, this reduction in feature size also has a significant impact on mixed-signal circuits. Due to the higher levels of integration, the majority of ASICs possesses some analog components. It has now become nearly mandatory to integrate both analog and digital circuits on the same substrate due to cost and power constraints. This book presents some of the newer problems and opportunities offered by the small device geometries and the high levels of integration that is now possible.The aim of this book is to summarize some of the most critical aspects of high-speed analog/RF communications circuits. Attention is focused on the impact of scaling, substrate noise, data converters, RF and wireless communication circuits and wireline communication circuits, including high-speed I/O.

Modern communications technology demands smaller, faster and more efficient circuits. This book reviews the fundamentals of electromagnetism in passive and active circuit elements, highlighting various effects and potential problems in designing a new circuit. The author begins with a review of the basics - the origin of resistance, capacitance, and inductance - then progresses to more advanced topics such as passive device design and layout, resonant circuits, impedance matching, high-speed switching circuits, and parasitic coupling and isolation techniques. Using examples and applications in RF and microwave systems, the author describes transmission lines, transformers, and distributed circuits. State-of-the-art developments in Si based broadband analog, RF, microwave, and mm-wave circuits are reviewed. With up-to-date results, techniques, practical examples, illustrations and worked examples, this book will be valuable to advanced undergraduate and graduate students of electrical engineering, and practitioners in the IC design industry. Further resources for this title are available at www.cambridge.org/9780521853507.

The only book on integrated circuits for optical communications that fully covers High-Speed IOs, PLLs, CDRs, and transceiver design including optical communication The increasing demand for high-speed transport of data has revitalized optical communications, leading to extensive work on high-speed device and circuit design. With the proliferation of the Internet and the rise in the speed of microprocessors and memories, the transport of data continues to be the bottleneck, motivating work on faster communication channels. Design of Integrated Circuits for Optical Communications, Second Edition deals with the design of high-speed integrated circuits for optical communication transceivers. Building upon a detailed understanding of optical devices, the book describes the analysis and design of critical building blocks, such as transimpedance and limiting amplifiers, laser drivers, phase-locked loops, oscillators, clock and data recovery circuits, and multiplexers. The Second Edition of this bestselling textbook has been fully updated with: A tutorial treatment of broadband circuits for both students and engineers New and unique information dealing with clock and data recovery circuits and multiplexers A chapter dedicated to burst-mode optical communications A detailed study of new circuit developments for optical transceivers An examination of recent implementations in CMOS technology This text is ideal for senior graduate students and engineers involved in high-speed circuit design for optical communications, as well as the more general field of wireline communications.

Focused on the field of knowledge lying between digital and analog circuit theory, this new text will help engineers working with digital systems shorten their product development cycles and help fix their latest design problems. The scope of the material covered includes signal reflection, crosstalk, and noise problems which occur in high speed digital machines (above 10 megahertz). This volume will be of practical use to digital logic designers, staff and senior communications scientists, and all those interested in digital design.

This book describes design techniques that can be used to mitigate crosstalk in high-speed I/O circuits. The focus of the book is in developing compact and low power integrated circuits for crosstalk cancellation, inter-symbol interference (ISI) mitigation and improved bit error rates (BER) at higher speeds. This book is one of the first to discuss in detail the problem of crosstalk and ISI mitigation encountered as data rates have continued beyond 10Gb/s. Readers will learn to avoid the data performance cliff, with circuits and design techniques described for novel, low power crosstalk cancellation methods that are easily combined with current ISI mitigation architectures.

This volume concentrates on three topics: mixed analog--digital circuit design, sensor interface circuits and communication circuits. The book comprises six papers on each topic of a tutorial nature aimed at improving the design of analog circuits. The book is divided into three parts. Part I: Mixed Analog--Digital Circuit Design considers the largest growth area in microelectronics. Both standard designs and ASICs have begun integrating analog cells and digital sections on the same chip. The papers cover topics such as groundbounce and supply-line spikes, design methodologies for high-level design and actual mixed analog--digital designs. Part II: Sensor Interface Circuits describes various types of signal conditioning circuits and interfaces for sensors. These include interface solutions for capacitive sensors, sigma--delta modulation used to combine a microprocessor compatible interface with on chip CMOS sensors, injectable sensors and responders, signal conditioning circuits and sensors combined with indirect converters. Part III: Communication Circuits concentrates on systems and implemented circuits for use in personal communication systems. These have applications in cordless telephones and mobile telephone systems for use in cellular networks. A major requirement for these systems is low power consumption, especially when operating in standby mode, so as to maximise the time between battery recharges.